Qualcomm will reportedly be shifting over to the Snapdragon 845 processor very soon, with some new details on what the inside of it will look like, thanks to new rumors from MyDrivers.
The upcoming Snapdragon 845 isn't expected until Q1 2018, but it will be based on the 10nm Low Power Early (LPE) FinFET process compared to the second-gen Low Power Plus (LPP) process from Samsung. In April, Ryan Lee, Vice President of Foundry Marketing at Samsung Electronics said: "With our successful 10LPE production experience, we have commenced production of the 10LPP to maintain our leadership in the advanced-node foundry market. 10LPP will be one of our key process offerings for high performance mobile, computing and network applications, and Samsung will continue to offer the most advanced logic process technology".
Snapdragon 845 is expected to rock four unannounced Cortex A57 cores alongside four low-power Cortex A53 cores, joined by Adreno 630 graphics. Qualcomm's super-fast Snapdragon X20 LTE modem will be used, offering 1.2Gbps speeds on Cat 18. Qualcomm will reportedly include support for UFS 2.1 storage, as well as the faster and more power efficient LPDDR4X RAM.
Right now this is all rumor territory, so we should expect some changes in what we have here as we get closer to the launch of Snapdragon 845.