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FMS 2014 - Samsung discusses 3D and TLC NAND in the datacenter

Samsung briefs us on their expanding list of SSD offerings (KRX:005930)

| IT/Datacenter News | Posted: Aug 14, 2014 7:10 pm

Flash Memory Summit 2014 - Ryan Smith, the Senior Manager of SSD Product Marketing for Samsung Semiconductor, Inc. (and Samsung Semiconductor's 2014 Employee of the Year in the U.S.), stopped by the booth to discuss the changing face of flash memory. Samsung have made tremendous waves in the last few years as they led the charge with 3bit MLC NAND (TLC) into the general computing space, and they are also the first to deliver TLC NAND products into the datacenter (product evaluation here). Many of Samsung's latest products focus on delivering cost-effective solutions to foster NANDs expanding footprint in the datacenter .

 

 

Samsung is also the first to market with 3D NAND (V-NAND), and has already progressed through 24 and 32-layer revisions. Standard MLC V-NAND was quite the accomplishment, and Samsung is building on that success by offering a TLC V-NAND product. Samsung has experienced plenty of success with TLC planar (2D) NAND, and the natural evolution to TLC V-NAND will strengthen their portfolio of TLC products. We have several product evaluations of Samsung SSDs in our IT/Datacenter Storage and Consumer Storage sections, and stay tuned for future evaluations as we receive products.

 

 

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