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RumorTT: Nintendo's next-gen console will blend portable with console

Rumors suggest that Nintendo will mix its popular DS format with its Wii Console in the company's next-generation console (TYO:7974)

| Gaming Consoles News | Posted: Mar 19, 2014 7:02 pm

phDetails have emerged this morning on what could be Nintendo's next-gen console. The new rumors come from a website Gaminrealm, and states that the an industry insider gave them exacting specs on Nintendo's successor to its mediocre Wii U console. Please remember that all rumors should be taken with a grain of salt, especially when the rumor originated with unamed sources.

 

TweakTown image news/3/6/36432_1_rumortt_nintendo_s_next_gen_console_will_blend_portable_with_console.jpg

 

Nintendo is reportedly referencing the whole project under the name fusion, with the console being titled Fusion Terminal and the controller / handheld getting the Fusion DS moniker. The reports do state that Nintendo's R&D department would like to keep these names as they are exciting a fresh which could breath new life into a stale company. Oddly enough, the system will be based off of an IBM processor and an AMD GPU while the controller / handheld will be based on ARM Cortex-A8 architecture. The full list of specs have been copied below, but keep in mind that these could change at any moment, or could be completely different as we speak.

 

FUSION DS

 

  • CPU: ARMv8-A Cortex-A53 GPU: Custom Adreno 420-based AMD GPU
  • COM MEMORY: 3 GB LPDDR3 (2 GB Games, 1 GB OS)
  • 2 130 mm DVGA (960 x 640) Capacitive Touchscreen
  • Slide Out Design with Custom Swivel Tilt Hinge
  • Upper Screen made of Gorilla Glass, Comes with Magnetic Cover
  • Low End Vibration for Gameplay and App Alerts
  • 2 Motorized Circle Pads for Haptic Feedback
  • Thumbprint Security Scanner with Pulse Sensing Feedback
  • 2 1mp Stereoptic Cameras
  • Multi-Array Microphone
  • A, B, X, Y, D-Pad, L, R, 1, 2 Buttons
  • 3 Axis Tuning Fork Gyroscope, 3 Axis Accelerometer, Magnetometer
  • NFC Reader
  • 3G Chip with GPS Location
  • Bluetooth v4.0 BLE Command Node used to Interface with Bluetooth Devices such as Cell Phones, Tablets
  • 16 Gigabytes of Internal Flash Storage (Possible Future Unit With 32 Gigbytes)
  • Nintendo 3DS Cart Slot
  • SDHC "Holographic Enhanced" Card Slot up to 128 GIGABYTE Limit
  • Mini USB I/O
  • 3300 mAh Li-Ion battery

 

FUSION TERMINAL

 

  • GPGPU: Custom Radeon HD RX 200 GPU CODENAME LADY (2816 shaders @ 960 MHz, 4.60 TFLOP/s, Fillrates: 60.6 Gpixel/s, 170 Gtexel/s)
  • CPU: IBM 64-Bit Custom POWER 8-Based IBM 8-Core Processor CODENAME JUMPMAN (2.2 GHz, Shared 6 MB L4 cache)
  • Co-CPU: IBM PowerPC 750-based 1.24 GHz Tri-Core Co-Processor CODENAME HAMMER
  • MEMORY: 4 Gigabytes of Unified DDR4 SDRAM CODENAME KONG, 2 GB DDR3 RAM @ 1600 MHz (12.8 GB/s) On Die CODENAMED BARREL
  • 802.11 b/g/n Wireless
  • Bluetooth v4.0 BLE
  • 2 USB 3.0
  • 1 Coaxial Cable Input
  • 1 CableCARD Slot
  • 4 Custom Stream-Interface Nodes up to 4 Wii U GamePads or 4 DSc
  • Versions with Disk Drive play Wii U Optical Disk (4 Layers Maximum), FUSION Holographic Versatile Disc (HVD) and Nintendo 3DS Card Slot.
  • 1 HDMI 2.0 1080p/4K Port
  • Dolby TrueHD 5.1 or 7.1 Surround Sound
  • Inductive Charging Surface for up to 4 FUSION DS or IC-Wii Remote Plus Controllers
  • Two versions: Disk Slot Version with 60 Gigs of Internal Flash Storage and Diskless Version with 300 Gigs of Internal Flash Storage.

NEWS SOURCES:Gaminrealm.com

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