Until now, shifting around data in 3D has been but a pipe dream, but the University of Cambridge have broken outside of that dream and began experimenting with a chip that is capable of much, much more.
The team at Cambridge have put a layer of ruthenium atoms between cobalt and platinum, where the researchers have found they can move data bo th up and down, in an otherwise silicon-based design through spintronics. This method uses the magnetic field manipulation to send information across the ruthenium to its destination.
This layering is perfect enough to create a "staircase" that has the data take one step at a time, incredible stuff! Unfortunately there's no ETA on whether this would take the step (pun intended) to real-world circuitry, but with all steps - it will eventually happen.