Mosaid Technologies have sampled the industry's first NAND flash MCP (multi-chip package) with a 16-die NAND stack operating on a single high-performance chip. Impressive, eh? Jin-Ki Kim, vice president of research and development at Mosaid:

The 16-die stack 512Gb HLNAND MCP demonstrates the superior scalability of HLNAND's ring architecture compared to the parallel bus architecture used in industry standard NAND Flash products. HLNAND's ring architecture allows a virtually unlimited number of NAND die to be connected on a single channel without performance degradation.

Mosaid's 512Gb HLNAND (HyperLink NAND) MCP combines a stack of 16 industry standard 32Gb NAND flash die with two HLNAND interface devices to hit 333MB/sec output over a single byte-wide HLNAND interface channel at 1.8V with no power termination resistors needed. Conventional NAND flash MCP designs cannot stack more than four NAND dies without being hit with performance degradation, and then also require two or more channels to deliver what Mosaid can do with one.

Peter Gillingham, vice president and chief technology officer at Mosaid adds:

The 16-die stack 512Gb HLNAND MCP demonstrates the superior scalability of HLNAND's ring architecture compared to the parallel bus architecture used in industry standard NAND Flash products. HLNAND's ring architecture allows a virtually unlimited number of NAND die to be connected on a single channel without performance degradation.