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Kingston EPOC Memory Technology Interview

| RAM News | Posted: Aug 28, 2002 4:38 am

Mikhailtech has posted an interview with Kingston about their new EPOC (Elevated Package Over CSP) memory technology.

4. Are there any performance benefits in terms of stability, reliability and speed?
(Comparing the Kingston EPOC technology to stacked-chip module designs): EPOC technology ensures better thermal performance by keeping the rows of memory chips independently connected to the PCB and without chip layer interconnects. The air channel that separates the two rows of chips aids in cooling the memory chips; the memory chip rows and their independent bonding to the PCB also conducts heat away from each chip through the leads (TSOP) or the solder balls (MicroBGA) and into the PCB. The improved thermals result in better stability and reliability. In terms of electrical performance, the EPOC DIMMs meet the electrical interface timings specified by the memory controller's manufacturer. Shorter leads, reduced signal length and lower capacitance loading have also indicated improved performance.
More information at Mikhailtech

 

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