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Kingmax planning nano thermal dissipation for 2400MHz DDR3 kit

A step away from traditional design to stand out
| RAM News | Posted: Jun 8, 2010 8:31 am

After an extended break, Kingmax are making another big splash in the memory market as they strive to make their way back up to the top tier enthusiast class segment.


It's been mentioned this week that they are planning something quite unique to stand out from the pack with an upcoming dual channel kit for LGA-1156 systems.




The modules will be rated to run at 2400MHz with CL10 latencies @ 1.5 to 1.8V. While that certainly isn't anything ground breaking by todays standards, what will be a standout feature is the type of cooling solution. Kingmax have opted for Nano Thermal Dissipation Technology; a nano-size thermal dissipation silicon compound that can remove heat from the memory chips efficiently and effectively without the requirement of a traditional heatsink.


The kit will be available in a 2x2GB arrangement, backed my a lifetime warranty. Unfortunately Kingmax hasn't released any images of the kit/cooling solution yet, nor pricing for that matter.



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