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Press Release: VIA KT333 Chipset

By: (more) | CPU, APU & Chipsets News | Posted: Feb 20, 2002 9:32 pm

VIA have just released their new KT333 chipset. This chipset features the same northbrige/southbridge as the KT266A chipset but with a few additions. The first is official DDR333 memory support and the second is ATA133 support incorporated into the southbridge. Here is the full press release:

 

Taipei, Taiwan, 20 February 2002 - VIA Technologies, Inc, a leading innovator and developer of core logic chipsets, microprocessors, and multimedia, networking and communications chips, today announced the launch of the VIA Apollo KT333, the first chipset to support new ultra fast DDR333 memory conforming to the JEDEC specification on the Socket A processor platform.

 

With 25% more memory bandwidth, the VIA Apollo KT333 offers the ultimate in high performance computing, excelling in the most demanding applications, and fully exploiting the unmatched performance of powerful AMD Athlon™ XP processors with QuantiSpeed™ Architecture.

 

The VIA Apollo KT333 also boasts the latest South Bridge technology with first to market innovations like Ultra ATA-133 in the VT8233A. Ultra ATA-133, offering 33% more bandwidth between hard drive and chipset, delivers the performance headroom needed for today's and tomorrow's data intensive applications, including video and gaming. The enhanced IDE controller supports all Ultra-DMA 33/66/100/133 devices including HDDs, CD-ROMS and DVD-ROMs as well as new generation BigDrive™ HDDs that break the previous 137GB limit on hard drive capacity and enable an exponential increase in data storage capacity for personal computing devices.

 

"The launch of the VIA Apollo KT333 demonstrates our continuing determination to bring the latest DDR memory technologies to market" commented Ted Lee, Vice President of Marketing, VIA Technologies, Inc. "The VIA Apollo KT333 chipset offers unequalled memory bandwidth to AMD Athlon™ XP processor based systems, delivering breathtaking performance across the application spectrum."

 

"VIA continues to deliver solid, high-performance chipsets that support AMD processor-based platforms. The KT333 chipset demonstrates AMD's strong infrastructure partner support and commitment to developing innovative Socket A platforms," said Rich Heye, vice president of Platform Engineering & Infrastructure for AMD's Computation Products Group.

 

VIA Apollo KT333

 

Supporting DDR200/266/333 memory and a full range of 200/266MHz Front Side Bus AMD Athlon™ and Duron™ processors, the VIA Apollo KT333 provides lightning fast access to system memory and delivers more application performance than rival Socket A chipset platforms.

 

The VIA Apollo KT333 is part of the V-MAP (VIA Modular Architecture Platform) family of chipsets, which guarantees pin compatibility across a wide range of VIA DDR products. V-MAP allows motherboard manufacturers, OEMs, and System Integrators to serve different market segments on a single, unified platform design. It can be paired with a choice of VT8233 series South Bridges including the VT8233C (with integrated 3Com® Ethernet MAC) and VT8233A (with Ultra ATA-133 IDE interface), which are connected through the chipset's high bandwidth V-Link Hub Architecture. Other key features include AGP4X, ATA-100, and PC133 support, as well as integrated six channel advanced audio, six USB ports, LPC bus, and integrated 10/100Mbps Ethernet and Home PNA, AC-97 audio and MC-97 modem.

 

About VIA Technologies, Inc.

 

VIA Technologies, Inc. is a leading innovator and developer of PC core logic chipsets, microprocessors, and multimedia, communications and networking chips. VIA delivers value to the PC industry by designing, marketing, and selling high-performance VIA Apollo core logic chipsets for the full range of PC platforms, and cost-effective VIA C3™ processors for Value PCs and Internet Appliances, as well as developing complete solutions for the PC platform through its VPSD Business Unit. Its customers include the world's top OEMs, mainboard manufacturers, and system integrators. VIA is headquartered in Taipei, Taiwan, at the center of the Greater China high-tech manufacturing engine, and has branch offices in the US, China and Europe. The company is listed on the Taiwan Stock Exchange (TSE2388), and achieved annual revenues of nearly US$1 billion in 2001. Additional information can be found at http://www.via.com.tw.

 



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