Word on AMD's imminent arrival of its Congo ultra-thin platform has just come out that that we should see it wrapped up late this month or early next. It was originally slated for a July launch but calls for ultra-thins at the time were few.
AMD's next generation ultra-thin notebook platform (Congo) will feature a dual-core Turion Neo X2 L625 or Athlon Neo X2 L335/L325 or single-core Athlon Neo MV-40 processor and M780G chipsets.
Although AMD has not yet announced the Congo platform, Hewlett-Packard (HP) has already launched s 12.1-inch ultra-thin notebook (DV2-1113AX) in Taiwan at a price at NT$25,000 (US$776.24) that features an Athlon Neo MV-40 CPU (that will be used in the Congo platform) combined with the RS690E chipset from the Yukon platform.
AMD also plans to launch two more ultra-thin platforms over the next two years, these codenamed Nile and Brazos. A further note lets us know AMD is on track to bring out its traditional notebook platform Tigris just after the launch of Windows 7. This will sport a 45nm processor which could be a Sempron M100, Athlon II M300, Turion II M500 or Turion II Ultra M600 series.
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