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Silicon Power intros Xpower Overclocking DDR2 RAM

FBGA and 8-layer PCB for higher module density

| RAM News | Posted: Mar 10, 2009 4:56 am

Silicon Power has introduced its first DRAM product meant for overclocking and gamers alike. The new Xpower series is available as DDR2-1066.

 

SILICON POWER launches Xpower overclocking series: DDR2-1066 MHz

(Click the above image for the large version)

 

The Xpower memory is available in 2GB and 4GB dual channel kits. By incorporating the advanced FBGA package technology and 8-layer PCB thus enabling higher module densities and higher performance. The new Xpower series also features an exclusive heat sink to reduce temperatures by dissipating heat more effectively. The RAM has supports CAS latency of 5-5-5-15 at 2.0 volts.

 

The full press release can be found here.

 

(Taipei, Taiwan) Silicon Power has unveiled its first overclocking DRAM product called the Xpower series for gamers, and all power users having a strong appetite for powerful memory. Incorporating FBGA package technology and original chips, Silicon Power Xpower DDR2-1066MHz 4GB (2GBX2) features high performance, superior heat spread ability and low power consumption. In Xpower overclocking series, the DDR2-1066MHz also supports CAS latency of 5-5-5-15 at 2.0 volts. Silicon Power exclusively developed Xpower series for the computer enthusiasts and gamers to DDR2 based computer systems that are demanded by overclockers.

 

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