SMT vs DIP
The Nanping factory has 10 SMT lines and six DIP lines. So, what is the difference? Certain components either reside on the PCB's surface or go straight through holes in the PCB. SMT (surface mount technology) refers to components and ICs which do not go through the PCB and are instead soldered to the top of the board. DIP (dual in-line process) refers to a technology where components have pins in two parallel rows, are inserted into holes on the PCB, and then soldered to the backside of the board/PCB; these components can also be referred to as through-hole components.
On the left is an X99-UD4P which has all of its SMDs (surface mount devices) mounted through SMT (surface mount technology). Typical SMD components are; chipsets, sockets, MOSETs, and other small components like resistors. SMT provides better operation for many components, reducing the amount of electrical noise that pins are susceptible to as well as allowing for the miniaturization of components, pins, and connections.
On the right is a 99FXA-UD7 which has all of its through-hole/DIP components mounted through insertion technology. Almost all slots and ports are mounted in this fashion as are can-type capacitors and many times, inductors. DIP provides much better durability than SMT, as components are more securely bonded to the motherboard. DIP also supports heavier or larger components such as IO ports.
One component that typically is DIP, but also has its SMT variant is the DRAM slot. GIGABYTE has experimented with SMT DIMMs on its OC lineup with great success. While DRAM slots can support SMT because memory modules are pretty light, other slots such as PCI-E would require an anchor if SMT is used, because of the amount of weight video cards might put on the slot.
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