A closer look at the chips
This is Intel's XMM 7360 modem which would offer 450Mbps downloads with 3x carrier aggregation. This would be paired with an x5 or x7 as they don't have integrated modems.
These are some of Intel's new discrete ICs for mobile, which are integrated into the Atom x3-C3440, the XMM726x, and XMM 7360 modem shown above. Intel has a new dual-band AC 8x70 chip, which is their first 28nm combo chip with Bluetooth 4.0 and an FM receiver. Intel's Wireless GNSS 2x00 would support all four major GPS satellite constellations.
This is the block diagram for the x5 and x7 processors. I see support for LP-DDR3/DDR3L, I2C, USB, SD, eDP, DP and HDMI 1.4b, and PCIe. Power support would come through SVID and I2C for monitoring. USB 3.0 support is also included. This new SOC has a lot of technologies crammed into a small package, many of which we see today in notebooks.
The Atom x3 will come in three different package types to fit a wide variety of devices. Intel has done a great job of covering many different market segments with the x3, and it wouldn't be crazy to see a future where a good chunk of phones feature Intel inside.
This is a closer look at the Atom x3 C3230RK which features the low power 3G modem. This would be most likely found in a lower cost device.
Intel's Atom x3-C3440 features LTE (4G) connectivity and a slew of other integrated features. I wouldn't be farfetched to see this SOC in your future phone. Intel has done a great job of revamping their Atom lineup to meet the demands of the mobile market. Their new portfolio is aimed to meet almost every market segment all the way from the Atom x3 in low-cost mobile devices to the x7 in devices like tablets. The Core M would replace anything with processing power needs above the Atom, and then the Core series takes over from there.
I look forward to seeing new devices with Cherry Trail and SoFIA hit the market, and I can't wait to see what will come of Intel's newest lineup.
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