Cooling - The Thermal Module
The Thermal Module, a significant part of improving the sound level and heat dissipation throughout the system that BTX was created to do
The BTX specifications call for a new location for the system processor. The relative position, at a locale close to the top and front of the motherboard, allows for a new way of cooling not only the processor but the highest heat producing components of the system through the use of a "thermal module."
The thermal module consists of a duct, seal, heatsink, fan, and clip. The duct encloses the heatsink area and forces the air inducted through the massive fan over the heatsink and processor directly to the upper back of the system in a tower case. After the airflow provides cooling for the processor, it continues through the system to the graphics subsystem, whether it is on a riser card or directly into a PCI Express slot, providing additional cooling to the video card. Supposedly, airflow then trickles throughout the rest of the system to the memory and the various other internal components.
The thermal module of BTX represents how the LGA-775 Prescott will have to be cooled. BTX will more than likely be coming to the market at the same time as the LGA-775 Prescott processors with such a higher heat production. The first motherboards we will see with BTX will probably be high-end solutions that target the wealthiest enthusiasts and workstation systems then as usual we'll see more affordable systems come onto the scene shortly afterwards.
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