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home > articles > cases, cooling and power supplies > 3-way thermal interface material shootout
3-Way Thermal Interface Material Shootout

Author: Mike Wright SUMMARY: With processors and video boards getting more powerful, they are also getting considerably hotter. Anyone with a computer needs to take a look at cooling. But there is more to this topic than just a good heatsink. There also has to be a manner to transfer the heat built up from the processor TO that good heatsink. This is where a good Thermal Interface Material (TIM) comes into play. Come join Mike "Darthtanion" Wright as he pits Arctic Silver III against OCZ Ultra II against Arctic Silver Ceramique. Who knows, the results just might surprise you!
Editor: Cameron Wilmot
Category: Cases, Cooling and Power Supplies
Published: 14th August 2003

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Introduction

With processors and video boards getting more powerful, they are also getting considerably hotter. Anyone with a computer needs to take a look at cooling. But there is more to this topic than just a good heatsink. There also has to be a manner to transfer the heat built up from the processor TO that good heatsink. This is where a good Thermal Interface Material (TIM) comes into play.

Since enthusiasts started cooking their processors at record speeds and temperatures, there has been Arctic Silver. Since the first iteration of this venerable TIM it has become the standard of which all other compounds are measured. But there are more players in the arena nowadays.

Today we will take a look at three hot products in this realm of goop; the vaunted Arctic Silver III, the newest AS product Arctic Silver Ceramique, and a silver based TIM from OCZ Technologies called OCZ Ultra II. We’re going to try to test these compounds to see if they have what it takes to be a contender to protect your own precious processor.








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