Socket B, A Significant Update?
The official name for LGA 1366 is Socket B and it is the successor to Socket T, or what is commonly referred to as Land Grid Array (LGA) 775. Socket B is the first of a new three socket system that Intel plans to unleash on the market. LGA 1160 is slated for use in entry level systems and LGA 1567 will handle server and workstation duty. At this time little is known about LGA 1160 and 1567, but LGA 1366 samples have been in the hands of component makers since early first quarter.
The first thing you will notice about the Core i7 processor is it has more surface area than the LGA 775 processors. The new Integrated Heat Spreader (IHS) is now comparable to AMD's modern IHS size.
This will allow for processor heat to be spread across a larger area. In turn, cooler manufacturers now have more room at the base to work with. Here we see the Nexus FLC-3000 LGA 1366 cooler base.
It is still debatable at this time as to whether or not Socket B truly required a specification change and if such a change was purely to help heatsink manufacturers sell more products. Here we see the back of an early X58 motherboard. Similar to AMD's socket used for Opteron workstation and server processors, a metal back plate has been added to secure the processor socket to the motherboard. This will allow less motherboard flex and ultimately better processor-to-heatsink contact while reducing the risk of motherboard damage when pressure is applied.
Here we see how much larger Socket B is compared to Socket T at the motherboard mounting point. The bracket is from a Nexus FLC-3000, the first LGA 1366 cooler to hit the U.S. TweakTown Office. As you can see, this is not a significant change from the proven LGA 775 mounting system.