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home > articles > casing & cooling > 4-way thermal interface material roundup > page 3
4-way Thermal Interface Material Roundup

Author: Mike Wright SUMMARY: We've got a pile of thermal goop on the table for comparison today; We compare two well known brands with two newcomers.
Editor: Steve Dougherty
Category: Casing & Cooling
Published: 12th November 2007

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A.I. Technology Cool Silver



One of our newcomers to the TIM wars is called Cool Silver. It is a compound manufactured by A.I. Technology, a name not familiar to a lot of us. That doesn’t mean they haven’t been around the playing field, however. These folks have been creating thermal interface materials for the past 25 years and have worked with manufacturers of components for military, aerospace and super-computer products during this time frame.

The goop itself is a silver based compound that A.I. Technology claims is completely nonconductive in bulk. Consistency of the Cool Silver is very smooth and applies easily without any noticeable buildup. Like the MX-2 compound noted on the previous page, this product requires no curing time so you won’t have to worry about burning in your build before you start cranking up the speeds.


Tuniq TX-2



Though you may not know the name “Tuniq”, odds are good you will recognize the parent company, Sunbeam. Many enthusiasts have spent more than a little green setting up specialized lighting effects from this manufacturer, so we already know that there is a bond present between the company and those who like to step away from the norm.

Their product, called TX-2, is the least thick in consistency. There is still plenty of body for application, but it spreads a bit easier than the other compounds tested. Coverage was excellent and I noted no areas where the paste did not protect.



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